Package information

SMTYF

6/8

2

Package information

●

Case: JEDEC DO-221AC molded plastic over Planar junction

●

Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

●

Polarity: Band indicates cathode

●

Flammability: Epoxy rated UL94V-0

●

RoHS package

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Table 5.

SMAflat dimensions

Ref.

Dimensions

Millimeters

Inches

Min. Typ. Max.

Min.

Typ.

Max.

A

0.90

1.10

0.035

0.043

b

1.25

1.65

0.049

0.065

c

0.15

0.40

0.006

0.016

D

2.25

2.95

0.088

0.116

E

4.80

5.60

0.189

0.220

E1

3.95

4.60

0.156

0.181

L

0.75

1.50

0.030

0.059

L1

0.50

0.019

L2

0.50

0.019

Figure 11.

SMAflat footprint dimensions

1.

SMA footprint may also be used.

Figure 12.

Marking information

D

A

L 2x

L

L2 2x

L1 2x

E E1

b

c

1.20

(0.047)

1.20

(0.047)

3.12

(0.123)

5.52

(0.217)

1.52

(0.060)

millimeters

(inches)

y w w

e3

z

x x x

e3: ECOPACK ( Leadfree)

XXX: Marking

Z: Manufacturing location

Y: Year

WW: week

Cathode bar (unidirectional devices only )