LSM330D datasheet(1/66 Pages) STMICROELECTRONICS

Part #	LSM330D

Description	Low power mode

PDF	66 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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1 / 66 page

This is information on a product in full production.

August 2012

Doc ID 022562 Rev 2

1/66

66

LSM330D

iNEMO inertial module:

3D accelerometer and 3D gyroscope

Datasheet — production data

Features

■ Analog supply voltage: 2.4 V to 3.6 V

■ Digital supply voltage IOs: 1.8 V

■ Low power mode

■ Power-down mode

■ 3 independent acceleration channels and 3

angular rate channels

■ ±2 g/±4 g/±8 g/±16 g dynamically selectable

full scale

■ ±250/±500/±2000 dps dynamically selectable

full scale

■ SPI/I2C serial interface (16-bit data output)

■ Programmable interrupt generator for free-fall

and motion detection

■ ECOPACK

® RoHS and “Green” compliant

Application

■ GPS navigation systems

■ Impact recognition and logging

■ Gaming and virtual reality input devices

■ Motion activated functions

■ Intelligent power saving for handheld devices

■ Vibration monitoring and compensation

■ Free-fall detection

■ 6D orientation detection

Description

The LSM330D is a system-in-package featuring a

3D digital accelerometer and a 3D digital

gyroscope.

ST’s family of MEMS sensor modules leverages

the robust and mature manufacturing processes

already used for the production of micromachined

accelerometers.

The various sensing elements are manufactured

using specialized micromachining processes,

while the IC interfaces are developed using a

CMOS technology that allows the design of a

dedicated circuit which is trimmed to better match

the sensing element characteristics.

The LSM330D has dynamically user-selectable

full scale acceleration range of ±2 g/±4 g/±8

g/±16 g and angular rate of ±250/±500/±2000

deg/sec.

The accelerometer and gyroscope sensors can

be either activated or separately put in Low

power/Power-down mode for applications

optimized for power saving.

The LSM330D is available in a plastic land grid

array (LGA) package.

Table 1.

Device summary

Part number

Temperature

range [°C]

Package

Packing

LSM330D

-40 to +85

LGA-28L

(3x5.5x1.0

mm)

Tray

LSM330DTR

-40 to +85

Tape and

reel

LGA-28L (3x5.5x1.0 mm)

www.st.com

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