IOBUS4 datasheet(81/88 Pages) FTDI

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C opyright © Future T ec hnology Devic es I nternational Limited

Datasheet

Vinculum-II Embedded Dual USB Host Controller IC

V ers ion 1 .7

Doc ument N o.: FT _000138 C learance N o.: FT DI# 1 43

Profile Feature

Pb Free Solder Process

(green material)

SnPb Eutectic and Pb free (non

green material) Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat:

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

Temperature TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

see Table 11.2

Time within 5°C of actual Peak

Temperature (tp)

30 to 40 seconds

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 11.1 Reflow Profile Parameter Values

SnPb Eutectic and Pb free (non green material)

Package Thickness

Volume mm3 < 350

Volume mm3 >=350

< 2.5 mm

235 +5/-0 °C

220 +5/-0 °C

≥ 2.5 mm

220 +5/-0 °C

Pb Free (green material) = 260 +5/-0 °C

Table 11.2 Package Reflow Peak Temperature

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