FT120T-R datasheet(35/40 Pages) FTDI

35 / 40 page

Document No.: FT_000646

FT120 USB DEVICE CONTROLLER WITH PARALLEL BUS IC

Datasheet Version 1.2

Clearance No.: FTDI#

291

9.5 Solder Reflow Profile

The FT120 is supplied in Pb free TSSOP-28 and QFN-28 packages. The recommended solder reflow profile

for both package options is shown in Figure 9-5.

Figure 9-5 FT120 Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9-1. Values are shown for

both a completely Pb free solder process (i.e. the FT120 is used with Pb free solder), and for a non-Pb

free solder process (i.e. the FT120 is used with non-Pb free solder).

Profile Feature

Pb Free Solder

Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

Temperature TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

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