IR2011 datasheet(2/17 Pages) IRF

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IR2011(S) & (PbF)

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

-0.3

250

High side floating supply offset voltage

VB - 25

VB + 0.3

VHO

High side floating output voltage

VS - 0.3

VB + 0.3

VCC

Low side fixed supply voltage

-0.3

VLO

Low side output voltage

-0.3

VCC +0.3

VIN

Logic input voltage (HIN & LIN)

COM -0.3

VCC +0.3

dVs/dt

Allowable offset supply voltage transient (figure 2)

—

V/ns

Package power dissipation @ TA ≤ +25°C

(8-lead DIP)

—

1.0

(8-lead SOIC)

—

0.625

RTHJA

Thermal resistance, junction to ambient

(8-lead DIP)

—

125

(8-lead SOIC)

—

200

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°C/W

°C

Note 1: Logic operational for VS of -4 to +200V. Logic state held for VS of -4V to -VBS.

Symbol

Definition

Min.

Max.

Units

High side floating supply absolute voltage

VS + 10

VS + 20

High side floating supply offset voltage

Note 1

200

VHO

High side floating output voltage

VCC

Low side fixed supply voltage

VLO

Low side output voltage

VCC

VIN

Logic input voltage (HIN & LIN)

COM

5.5

Ambient temperature

-40

125

°C

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. The VS and COM offset ratings

are tested with all supplies biased at 15V differential.

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