ADA4950-2YCPZ-R7 datasheet(7/26 Pages) AD

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Data Sheet

ADA4950-1/ADA4950-2

Rev. B | Page 7 of 26

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 4

Input Current, +INx, −INx, PD

±5 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

ADA4950-1

−40°C to +105°C

ADA4950-2

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p printed circuit board, as

described in EIA/JESD51-7.

Table 8. Thermal Resistance

Package Type

θJA

θJC

Unit

ADA4950-1, 16-Lead LFCSP (Exposed Pad)

°C/W

ADA4950-2, 24-Lead LFCSP (Exposed Pad)

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4950-x package

is limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the ADA4950-x. Exceeding a junction temper-

ature of 150°C for an extended period can result in changes in

the silicon devices, potentially causing failure.

The power dissipated in the package (PD) is the sum of the quies-

cent power dissipation and the power dissipated in the package

due to the load drive. The quiescent power is the voltage between

the supply pins (VS) times the quiescent current (IS). The power

dissipated due to the load drive depends upon the particular

application. The power dissipated due to the load drive is calcu-

lated by multiplying the load current by the associated voltage

drop across the device. RMS voltages and currents must be used

in these calculations.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and

power planes reduces θJA.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the single 16-lead

LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on

a JEDEC standard 4-layer board with the exposed pad soldered

to a PCB pad that is connected to a solid plane.

0.5

1.0

1.5

2.0

2.5

3.0

3.5

–40

–20

100

AMBIENT TEMPERATURE (°C)

ADA4950-2

ADA4950-1

Figure 4. Maximum Power Dissipation vs. Ambient Temperature

for a 4-Layer Board

ESD CAUTION

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