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MF-RHT750 Datasheet(PDF) 3 Page - Bourns Electronic Solutions |
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MF-RHT750 Datasheet(HTML) 3 Page - Bourns Electronic Solutions |
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3 / 4 page ![]() IEC EIA Dimensions Dimension Description Mark Mark Dimensions Tolerance Carrier tape width W W 18 -0.5/+1.0 (.709) (-0.02/+.039) Hold down tape width W0 W4 11 min. (.433) Hold down tape No protrusion Top distance between tape edges W2 W6 3 max. (.118) Sprocket hole position W1 W5 9 -0.5/+0.75 (.354) (-0.02/+0.03) Sprocket hole diameter D0 D0 4 ±0.2 (.157) (±.0078) Abscissa to plane (straight lead) H H 18.5 ±3.0 (.728) (±.118) Abscissa to plane (kinked lead) H0 H0 16 ±0.5 (.63) (±.02) Abscissa to top: MF-RHT050 ~ MF-RHT450 H1 H1 32.2 max. (1.268) Abscissa to top: MF-RHT650 ~ MF-RHT1300 H1 H1 45.0 max. (1.837) Overall width w/lead protrusion: MF-RHT050 ~ MF-RHT450 C1 42.5 max. (1.673) Overall width w/lead protrusion: MF-RHT650 ~ MF-RHT1300 C1 55.0 max. (2.165) Overall width w/o lead protrusion: MF-RHT050 ~ MF-RHT450 C2 42.5 max. (1.673) Overall width w/o lead protrusion: MF-RHT650 ~ MF-RHT1300 C2 54.0 max. (2.126) Lead protrusion I1 L1 1.0 max. (.039) Protrusion of cutout L L 11 max. (.433) Protrusion beyond hold-down tape I2 I2 Notspecified Sprocket hole pitch P0 P0 12.7 ±0.3 (0.5) (±.012) Pitch tolerance 20 consecutive ±1 (±.039) Device pitch: MF-RHT070 ~ MF-RHT450 12.7 ±0.3 (0.5) (±.012) Device pitch: MF-RHT050 and MF-RHT650 ~ MF-RHT1300 25.4 ±0.6 (1.0) (±.024) Tape thickness t t 0.9 max. (.035) Tape thickness with splice: MF-RHT050 ~ MF-RHT200 t1 1.5 max. (.059) Tape thickness with splice: MF-RHT450 ~ MF-RHT1300 t1 2.3 max. (.091) Splice sprocket hole alignment 4.0 ±0.2 (.157) (±.008) Body lateral deviation Δ h Δ h 0 ±1 (±.039) Body tape plane deviation Δ p Δ p 0 ±0.3 (±.012) Ordinate to adjacent component lead P1 P1 3.81 ±0.07 (.015) (±.028) MF-RHTSeriesTapeandReelSpecifications Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Devices taped using EIA468–B/IEC60286-2 standards. See table below and Figures 1 and 2 for details. DIMENSIONS: MM (INCHES) DIMENSIONS: MM (INCHES) |
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