CC2400-RTR1 datasheet(56/84 Pages) TI1

56 / 84 page

CC2400

SWRS042A

Page 56 of 83

47 PCB Layout Recommendations

A four layer PCB is highly recommended.

The second layer of the PCB should be

the “ground-layer”.

The top layer should be used for signal

routing, and the open areas should be

filled with metallization connected to

ground using several vias.

The area under the chip is used for

grounding and must be connected closely

to the ground plane with several vias.

The ground pins should be connected to

ground as close as possible to the

package pin using individual vias. The de-

coupling capacitors should also be placed

as close as possible to the supply pins

and connected to the ground plane by

separate vias. Supply power filtering is

very important.

The external components should be as

small as possible (0402 is recommended)

and surface mount devices must be used.

Please note that components smaller than

those

specified

may

have

differing

characteristics.

Caution should be used when placing the

microcontroller

order

avoid

interference with the RF circuitry.

A Development Kit with a fully assembled

Evaluation Module is available. It is

strongly advised that this reference layout

is followed very closely in order to achieve

the best performance.

The schematic, BOM and layout Gerber

files for the reference designs are all

available from the Chipcon website.

CC2400-RTR1 Datasheet(PDF) 56 Page - Texas Instruments

CC2400-RTR1 Datasheet(HTML) 56 Page - Texas Instruments

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