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CC1100-RTY1 Datasheet(PDF) 19 Page - Texas Instruments

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Part # CC1100-RTY1
Description  Low-Power Sub- 1 GHz RF Transceiver
PDF  100 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CC1100-RTY1 Datasheet(HTML) 19 Page - Texas Instruments

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CC1100
SWRS038D
Page 19 of 92
7
Application Circuit
Only a few external components are required
for using the
CC1100. The recommended
application circuits are shown in Figure 3 and
Figure 4. The external components are
described in Table 14, and typical values are
given in Table 15.
Bias Resistor
The bias resistor R171 is used to set an
accurate bias current.
Balun and RF Matching
The components between the RF_N/RF_P
pins and the point where the two signals are
joined together (C131, C121, L121 and L131
for the 315/433 MHz reference design [5].
L121, L131, C121, L122, C131, C122 and
L132 for the 868/915 MHz reference design
[6]) form a balun that converts the differential
RF signal on
CC1100 to a single-ended RF
signal. C124 is needed for DC blocking.
Together with an appropriate LC network, the
balun
components
also
transform
the
impedance to match a 50
Ω antenna (or
cable). Suggested values for 315 MHz, 433
MHz, and 868/915 MHz are listed in Table 15.
The balun and LC filter component values and
their placement are important to keep the
performance
optimized.
It
is
highly
recommended to follow the CC1100EM
reference design [5] and [6].
Crystal
The crystal oscillator uses an external crystal
with two loading capacitors (C81 and C101).
See Section 27 on page 53 for details.
Additional Filtering
Additional external components (e.g. an RF
SAW filter) may be used in order to improve
the performance in specific applications.
Power Supply Decoupling
The power supply must be properly decoupled
close to the supply pins. Note that decoupling
capacitors are not shown in the application
circuit. The placement and the size of the
decoupling capacitors are very important to
achieve
the optimum performance. The
CC1100EM reference design ([5] and [6])
should be followed closely.
Component
Description
C51
Decoupling capacitor for on-chip voltage regulator to digital part
C81/C101
Crystal loading capacitors, see Section 27 on page 53 for details
C121/C131
RF balun/matching capacitors
C122
RF LC filter/matching filter capacitor (315 and 433 MHz). RF balun/matching
capacitor (868/915 MHz).
C123
RF LC filter/matching capacitor
C124
RF balun DC blocking capacitor
C125
RF LC filter DC blocking capacitor (only needed if there is a DC path in the antenna)
L121/L131
RF balun/matching inductors (inexpensive multi-layer type)
L122
RF LC filter/matching filter inductor (315 and 433 MHz). RF balun/matching inductor
(868/915 MHz). (inexpensive multi-layer type)
L123
RF LC filter/matching filter inductor (inexpensive multi-layer type)
L124
RF LC filter/matching filter inductor (inexpensive multi-layer type)
L132
RF balun/matching inductor. (inexpensive multi-layer type)
R171
Resistor for internal bias current reference.
XTAL
26MHz - 27MHz crystal, see Section 27 on page 53 for details.
Table 14: Overview of External Components (excluding supply decoupling capacitors)



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