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EXAMPLE BOARD LAYOUT

4X

0.23 0.02

(0.4) TYP

(0.4) TYP

(

)

METAL

0.23

0.05 MAX

SOLDER MASK

OPENING

METAL

UNDER

MASK

(

)

SOLDER MASK

OPENING

0.23

0.05 MIN

4219460/A 02/2014

DSBGA - 0.625 mm max height

YFF0004

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:50X

1

2

A

B

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED