LMV331M7SLASHNOPB datasheet(4/38 Pages) TI1

4 / 38 page

LMV331-N, LMV339-N, LMV393-N

SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential Input Voltage

±Supply

Voltage

Voltage on any pin (referred to V− pin)

5.5

Soldering Information

Infrared or Convection (20 sec)

235

°C

Junction Temperature (3)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±800

V(ESD)

Electrostatic discharge

Machine model

±120

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

2.7

Temperature Range (2)

−40

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.

6.4 Thermal Information

LMV331-N

LMV339-N

LMV393-N

THERMAL METRIC(1)

DCK

DBV

DGK

UNIT

5 PINS

14 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

478

265

145

155

190

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 2.7-V DC Electrical Characteristics

Unless otherwise specified, all limits ensured for TJ = 25°C, V

+ = 2.7V, V− = 0V.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

(1)

(2)

(1)

VOS

Input Offset Voltage

1.7

TCVOS

Input Offset Voltage Average Drift

At the temperature extremes

µV/°C

(1)

All limits are ensured by testing or statistical analysis.

(2)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

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