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MIC4428BMM Datasheet(PDF) 6 Page - Micrel Semiconductor |
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MIC4428BMM Datasheet(HTML) 6 Page - Micrel Semiconductor |
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6 / 8 page ![]() MIC4426/4427/4428 Micrel MIC4426/4427/4428 6 September 1999 Applications Information Supply Bypassing Large currents are required to charge and discharge large capacitive loads quickly. For example, changing a 1000pF load by 16V in 25ns requires 0.8A from the supply input. To guarantee low supply impedance over a wide frequency range, parallel capacitors are recommended for power sup- ply bypassing. Low-inductance ceramic MLC capacitors with short lead lengths (< 0.5") should be used. A 1.0 µF film capacitor in parallel with one or two 0.1 µF ceramic MLC capacitors normally provides adequate bypassing. Grounding When using the inverting drivers in the MIC4426 or MIC4428, individual ground returns for the input and output circuits or a ground plane are recommended for optimum switching speed. The voltage drop that occurs between the driver’s ground and the input signal ground, during normal high-current switching, will behave as negative feedback and degrade switching speed. Control Input Unused driver inputs must be connected to logic high (which can be V S) or ground. For the lowest quiescent current (< 500 µA) , connect unused inputs to ground. A logic-high signal will cause the driver to draw up to 9mA. The drivers are designed with 100mV of control input hyster- esis. This provides clean transitions and minimizes output stage current spikes when changing states. The control input voltage threshold is approximately 1.5V. The control input recognizes 1.5V up to V S as a logic high and draws less than 1 µA within this range. The MIC4426/7/8 drives the TL494, SG1526/7, MIC38C42, TSC170 and similar switch-mode power supply integrated circuits. Power Dissipation Power dissipation should be calculated to make sure that the driver is not operated beyond its thermal ratings. Quiescent power dissipation is negligible. A practical value for total power dissipation is the sum of the dissipation caused by the load and the transition power dissipation (P L + PT). Load Dissipation Power dissipation caused by continuous load current (when driving a resistive load) through the driver’s output resistance is: P L = IL 2 R O For capacitive loads, the dissipation in the driver is: P L = f CL VS 2 Transition Dissipation In applications switching at a high frequency, transition power dissipation can be significant. This occurs during switching transitions when the P-channel and N-channel output FETs are both conducting for the brief moment when one is turning on and the other is turning off. P T = 2 f VS Q Charge (Q) is read from the following graph: 1 ×10-8 8 ×10-9 4 ×10-9 3 ×10-9 2 ×10-9 6 ×10-9 1 ×10-9 4 6 8 10 1214 1618 SUPPLY VOLTAGE (V) Crossover Energy Loss per Transition |
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