Pad Description

Pad No.

Pad Name

I/O

Internal

Connection

Description

1

DGND

I

¾

Digital ground

2

OSC_O

O

¾

System oscillator output

3

VCO

I

¾

System oscillator input, system frequency

adjustable pin

4

CC1

¾¾

Current control 1

5

CC0

¾¾

Current control 0

6

OP1_OUT

O

¾

OP1 output

7

OP1_IN

I

¾

OP1 input

8

OP2_IN

I

¾

OP2 input

9

OP2_OUT

O

¾

OP2 output

10

LPF2_IN

I

¾

Low pass filter 2 input

11

LPF2_OUT

O

¾

Low pass filter 2 output

12

LPF1_OUT

O

¾

Low pass filter 1 output

13

LPF1_IN

I

¾

Low pass filter 1 input

14

VCC

I

¾

Analog and positive power supply

15

REF

I

¾

Analog reference voltage

16

AGND

I

¾

Analog ground

Absolute Maximum Ratings

Supply Voltage.................................-0.3V to 6V

Storage Temperature.................-50°Cto125°C

Operating Temperature ..............-20°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-

mum Ratings² may cause substantial damage to the device. Functional operation of this device

at other conditions beyond those listed in the specification is not implied and prolonged expo-

sure to extreme conditions may affect device reliability.

HT8970

4

March 14, 2000