116

sPrecautions

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warp age (SMT)

5. Recommended Soldering Condition(Through hole)

6. Cleaning Condition

7. Connection Condition

Note1: UP to 2 cycles of Reflow soldering are possible under the same conditions, provided that

there is a return to normal temperature between the first and second cycle

Note2: The temperature profile indicates the board surface temperature at the point of contacts

with the connector terminals.

Note3: This reflow profile is for the connectors packaged in embossed tape(reel), with desiccant in

the package.

Note4: Reflow temperature for SMT connectors in another package is 240ç, 10 sec.max.

Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds

0.15 to 0.2mm

Based on the both connector edges, 0.03mm max. is allowed in the connector center area.

Flow: 250ç for 10 seconds

Manual soldering: 290ç for 2 seconds

Refer to the "Nylon Connector Use Hand book".

Refer to the "Nylon Connector Use Hand book".

180±10

100

150

200

250

230

Time (S)

Temperature (ç)

60s max

10s max

100 to 120s

165±5

100

150

200

240

230

Time (S)

Temperature (ç)

60s max

10s max

90 to 120s

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.