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STM32F205RC Datasheet(PDF) 70 Page - STMicroelectronics

Part # STM32F205RC
Description  ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/1284KB RAM
PDF  178 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F205RC Datasheet(HTML) 70 Page - STMicroelectronics

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Electrical characteristics
STM32F20xxx
70/178
DocID15818 Rev 11
VBAT
Backup operating voltage
1.65
3.6
V
VIN
I/O input voltage
FT and TTa I/O
TBD
TBD
BOOT0
TBD
TBD
VCAP1
Internal core voltage to be supplied
externally in REGOFF mode
1.1
1.3
V
VCAP2
PD
Power dissipation at TA = 85 °C for
suffix 6 or TA = 105 °C for suffix 7(5)
LQFP64
-
444
mW
WLCSP64+2
-
392
LQFP100
-
434
LQFP144
-
500
LQFP176
-
526
UFBGA176
-
513
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
–40
85
°C
Low power dissipation(6)
–40
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
–40
105
°C
Low power dissipation(6)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1. TBD stands for “to be defined”.
2. On devices in WLCSP64+2 package, if IRROFF is set to VDD, the supply voltage can drop to 1.7 V when the device
operates in the 0 to 70 °C temperature range using an external power supply supervisor (see Section 3.16).
3. When the ADC is used, refer to Table 66: ADC characteristics.
4. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and
VDDA can be tolerated during power-up and power-down operation.
5. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
6. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 14. General operating conditions(1) (continued)
Symbol
Parameter
Conditions
Min
Max
Unit



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