PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

Addendum-Page 2

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

LM358AMX/NOPB

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-1-260C-UNLIM

0 to 70

LM

358AM

LM358AN

NRND

PDIP

P

8

40

TBD

Call TI

Call TI

0 to 70

LM

358AN

LM358AN/NOPB

ACTIVE

PDIP

P

8

40

Green (RoHS

& no Sb/Br)

CU SN

Level-1-NA-UNLIM

0 to 70

LM

358AN

LM358H/NOPB

ACTIVE

TO-99

LMC

8

500

Green (RoHS

& no Sb/Br)

POST-PLATE

Level-1-NA-UNLIM

0 to 70

LM358H

LM358M

NRND

SOIC

D

8

95

TBD

Call TI

Call TI

0 to 70

LM

358M

LM358M/NOPB

ACTIVE

SOIC

D

8

95

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-1-260C-UNLIM

0 to 70

LM

358M

LM358MX

NRND

SOIC

D

8

2500

TBD

Call TI

Call TI

0 to 70

LM

358M

LM358MX/NOPB

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-1-260C-UNLIM

0 to 70

LM

358M

LM358N

NRND

PDIP

P

8

40

TBD

Call TI

Call TI

0 to 70

LM

358N

LM358N/NOPB

ACTIVE

PDIP

P

8

40

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-1-NA-UNLIM

0 to 70

LM

358N

LM358TP/NOPB

ACTIVE

DSBGA

YPB

8

250

Green (RoHS

& no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

0 to 70

A

07

LM358TPX/NOPB

ACTIVE

DSBGA

YPB

8

3000

Green (RoHS

& no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

0 to 70

A

07

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.