STPS745

Package information

7/9

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 6.

TO-220AC dimensions

Ref

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.40

4.60

0.173

0.181

C

1.23

1.32

0.048

0.051

D

2.40

2.72

0.094

0.107

E

0.49

0.70

0.019

0.027

F

0.61

0.88

0.024

0.034

F1

1.14

1.70

0.044

0.066

F2

1.14

1.70

0.044

0.066

G

4.95

5.15

0.194

0.202

G1

2.40

2.70

0.094

0.106

H2

10

10.40

0.393

0.409

L2

16.4 typ.

0.645 ty

p.

L4

13

14

0.511

0.551

L5

2.65

2.95

0.104

0.116

L6

15.25

15.75

0.600

0.620

L7

6.20

6.60

0.244

0.259

L9

3.50

3.93

0.137

0.154

M

2.6 typ.

0.102 typ.

Diam.

3.75

3.85

0.147

0.151

A

C

D

L7

Ø I

L5

L6

L9

L4

F

H2

G

L2

F1

E

M