• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

176

1. Standard Land Pattern Dimensions

Soldering and Mounting

Chip Common Mode Choke Coil

DLM11G

DLM2HG

DLP0NS

DLP11S

DLP11T

DLP1ND

DLP2AD

DLP31S

DLP31D

DLW21S

DLW21H

DLW31SN

DLW5AH

DLW5B

oReflow and Flow

oReflow Soldering

DLP31S

DLP31D

DLW5AH/5B

1.6mm (DLW31S) it may result in components turning

around, because melting speed is different. In the worst

case, short circuit between lines may occur.

case, short circuit between lines may occur due to spread

of soldering paste or mount placing accuracy.

1.6mm (DLW31SN), the bending strength will be reduced.

Do not use gild pattern; excess soldering heat may dissolve

metal of a copper wire.

1.0 0.6 1.0

2.8

0.8 Pitch

0.4

DLM2HG

1.0

4.0

Land Pattern

Land Pattern

+ Solder Resist

Solder Resist

(in mm)

DLW21S/H

DLW31SN

0.8

1.6

0.4

0.4

Series

a

1.2

1.6

d

2.6

3.7

bc

DLP11S

DLP11T

DLM11G

0.5

1.5

DLP2AD

1.75

0.25

0.5

DLW21S/21H/31SN

a

b

DLP0NS

0.90

0.30

0.9

2.9

5.5

DLP1ND

1.4

0.2

0.4

0.55

0.55

1.95

1.55

PCB should be designed so that products are not

subjected to the mechanical stress caused by warping

the board.

Poor example

Products should be located in the sideways direction

(Length: a<b) to the mechanical stress.

Good example

a

b