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MPZ2012 Datasheet(PDF) 10 Page - TDK Electronics

Part # MPZ2012
Description  Chip Beads For Power Line
PDF  11 Pages
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Manufacturer  TDK [TDK Electronics]
Direct Link  http://www.tdk.com
Logo TDK - TDK Electronics

MPZ2012 Datasheet(HTML) 10 Page - TDK Electronics

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• All specifications are subject to change without notice.
(9/10)
001-05 / 20110928 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ2012
FEATURES
• The MPZ series are multilayer chip impeders for power supply
line applications.
• High miniaturized, these parts nonetheless exhibit low DC
resistance and high current handling capability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1)Series name
(2)Dimensions L
×W
(3)Material code
(4)Nominal impedance
331: 330
Ω at 100MHz
(5)Characteristic type
(6)Packaging style
T: Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MPZ 2012 S 331 A
T
(1)
(2) (3) (4) (5) (6)
Operating/storage
–55 to +125°C
Packaging style
Quantity
Taping
4000 pieces/reel
0.5
±0.3
2.0
±0.2
Weight: 8mg
Dimensions in mm
1
0.8
0.8
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.



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