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LUCL9500AGF-D Datasheet(PDF) 21 Page - Agere Systems |
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LUCL9500AGF-D Datasheet(HTML) 21 Page - Agere Systems |
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21 / 32 page ![]() Preliminary Data Sheet September 2001 High-Voltage Ringing SLIC for VoIP Applications L9500A Agere Systems Inc. 21 Applications Power Control Under normal device operating conditions, power dissi- pation on the device must be controlled to prevent the device temperature from rising above the thermal shut- down and causing the device to shut down. Power dis- sipation is highest with higher battery voltages, higher current limit, and under shorter dc loop conditions. Additionally, higher ambient temperature will also reduce thermal margin. To support required power ringing voltages, this device is meant to operate with a high-voltage primary battery (–65 V to –75 V typically). Thus, power control is nor- mally achieved by use of the battery switch and an aux- iliary lower absolute voltage battery. Operating temperature range, maximum current limit, maximum battery voltage, minimum dc loop length and protection resistors values, airflow, and number of PC board lay- ers will influence the overall thermal performance. The following example illustrates typical thermal design considerations. The thermal resistance of the 28-pin PLCC package is typically 35.5 °C/W, which is representative of the natu- ral airflow as seen in a typical switch cabinet with a multilayer board. The L9500 will enter thermal shutdown at a typical tem- perature of 150 °C. The thermal design should ensure that the SLIC does not reach this temperature under normal operating conditions. For this example, assume a maximum ambient operat- ing temperature of 85 °C, a designed current limit of 30 mA, a maximum battery of –75 V, and an auxiliary battery of –21 V. Assume a (worst-case) minimum dc loop of 20 Ω of wire resistance, 30 Ω protection resis- tors, and 200 Ω for the handset. Additionally, include the effects of parameter tolerance. 1. TTSD – TAMBIENT(max) = allowed thermal rise. 150°C – 85 °C = 65 °C. 2. Allowed thermal rise = package thermal impedance • SLIC power dissipation. 65 °C = 35.5°C/W • SLIC power dissipation SLIC power dissipation (PD) = 1.83 W. Thus, if the total power dissipated in the SLIC is less than 1.83 W, it will not enter the thermal shutdown state. Total SLIC power is calculated as: Total PD = maximum battery • maximum current limit + SLIC quiescent power. For the L9500A, the worst-case SLIC on-hook active power is 64 mW. Thus, Total off-hook power = (ILOOP)(current-limit tolerance) * (VBATAPPLIED) + SLIC on-hook power Total off-hook power = (0.030 A)(1.08) * (21) + 75 mW Total off-hook power = 744.4 mW The power dissipated in the SLIC is the total power dis- sipation less the power that is dissipated in the loop. SLIC PD = Total power – loop power Loop off-hook power = (ILOOP * 1.08)2 • (RLOOP(dc) min + 2RPROTECTION + RHANDSET) Loop off-hook power = ((0.030 A)(1.08))2 • (20 Ω + 60 Ω + 200 Ω) Loop off-hook power = 293.9 mW SLIC off-hook power = Total off-hook power – loop off-hook power SLIC off-hook power = 744.4 mW – 293.9 mW SLIC off-hook power = 450.5 mW < 1.83 W Thus, under the worst-case normal operating condi- tions of this example, the thermal design, using the auxiliary, is adequate to ensure the device is not driven into thermal shutdown under worst-case operating con- ditions. |
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