VNH7013XP-E datasheet(19/24 Pages) STMICROELECTRONICS

19 / 24 page

VNH7013XP-E

Package and PCB thermal data

Doc ID 022370 Rev 3

19/24

Figure 17.

Thermal fitting model of an H-bridge in PowerSSO-36

Table 15.

Thermal parameters(1)

The blank space means that the value is the same as the previous one.

Area/island (cm2)

Footprint

R1 = R7 (°C/W)

0.2

R2 = R8 (°C/W)

1.6

R3 (°C/W)

R4 (°C/W)

R5 (°C/W)

R6 (°C/W)

R9 = R15 (°C/W)

0.1

R10 = R16 (°C/W)

2.8

R11 = R17 (°C/W)

R12 = R18 (°C/W)

R13 = R19 (°C/W)

R14 = R20 (°C/W)

R21 = R22 (°C/W)

R23 (°C/W)

C1 = C7 = C9 = C15 (W.s/°C)

0.001

C2 = C8 (W.s/°C)

0.009

C3 (W.s/°C)

0.09

C4 (W.s/°C)

0.5

0.8

C5 (W.s/°C)

0.8

1.4

C6 (W.s/°C)

C10 = C16 (W.s/°C)

0.1

C11 = C17 (W.s/°C)

0.07

C12 = C18 (W.s/°C)

0.45

0.6

C13 = C19 (W.s/°C)

0.8

1.2

2.5

C14 = C20 (W.s/°C)

C21 = C22 = C23 (W.s/°C)

0.01

0.006

0.005

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