BFS520 datasheet(51/130 Pages) NXP

51 / 130 page

NXP Semiconductors RF Manual 16th edition

New CATV GaAs platform layout

2.2.2

Highlyefficientline-upof1GHzGaAsmodulesforsustainableCATVnetworks

NXP high gain power doublers CGD104xHi and push-pulls CGY104

Designed for 1 GHz “sustainable networks,” these high-performance GaAs devices enable extended

bandwidth and higher data rates. They deliver increased network capacity and make way for high-end

services like HDTV, VoIP, and digital simulcasting.

Key features

` Excellent linearity, stability, and reliability

` High power gain for power doublers

` Extremely low noise

` Dark Green products

` GaAs HFET dies for high-end applications

` Rugged construction

` Superior levels of ESD protection

` Integrated ringwave protection

` Design optimized for digital channel loading

` Temperature compensated gain response

` Optimized heat management

` Excellent temperature resistance

Key benefits

` Simple upgrade to 1-GHz capable networks

` Low total cost of ownership

` High power-stress capability

` Highly automated assembly

Key applications

` Hybrid Fiber Coax (HFC) applications

` Line extenders

` Trunk amplifiers

` Fiber deep-optical-node (N+0/1/2)

` Bridgers

The NXP power doublers CGD104xH and CGD104xHi are ideal

for use in line extenders and trunk amplifiers. They support

fiber deep-optical-node applications (N+0/1/2), delivering

the highest output power on the market today. The GaAs HFET

die process delivers high gain, excellent CTB and CSO ratings,

and lower current.

The new NXP CGY104x push-pull family is the first line-up on

the market to combine very low noise, best-in-class distortion

parameters, and low, “carbon footprint” capabilities. It delivers

the best performance for the lowest power consumption,

so it reduces OPEX and CO

2 emissions

All of NXP’s 1 GHz solutions are designed for durability and

offer superior ruggedness, an extended temperature range,

high-power overstress capabilities, and extremely high ESD

levels. As a result, they also reduce the cost of ownership.

The GaAs die is inserted in an HVQFN package that is then

mounted on thermal vias that manage heat transfer to the

heat sink. Temperature-control circuitry keeps the module's

high performance stable over a wide range of temperature.

Assembly is fully automated and requires almost no human

intervention, so repeatability remains very high.

BFS520 Datasheet(PDF) 51 Page - NXP Semiconductors

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