MMBZ5221B - MMBZ5259B

Document number: DS18011 Rev. 21 - 2

1 of 5

www.diodes.com

August 2010

© Diodes Incorporated

MMBZ5221B - MMBZ5259B

350mW SURFACE MOUNT ZENER DIODE

Features

•

Planar Die Construction

•

350mW Power Dissipation on FR-4 PCB

•

General Purpose, Medium Current

•

Ideally Suited for Automated Assembly Processes

•

Lead, Halogen and Antimony Free, RoHS Compliant "Green"

Device (Notes 2 and 3)

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

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Case: SOT-23

•

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020

•

Terminal Connections: See Diagram

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Marking Information: See Page 4

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Ordering Information: See Page 4

•

Weight: 0.008 grams (approximate)

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

350

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

357

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf

2. No purposefully added lead. Halogen and Antimony Free.

3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code

Top View

Device Schematic