NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

21.05.2008

FERRITE CHIP BEADS

Z2 SERIES

8. RELIABILITY & TEST CONDITION :

Time (sec)

Force (Kfg)

Size

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

right conditions.

right conditions.

Flexture Strength

100(3.937)

45(1.772) 45(1.772)

40(1.575)

Bending

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

7

W

20(.787)

8

4

5

6

W

1

3

2

1.5

2.0

> 25

1.0

1.0

1.0

0.2

0.6

0.5

More than 90% of the terminal electrode

should be covered with solder.

245°C

150°C

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

260°C

150°C

30°C max. ( t)

Impedance change : Within ±30%

Appearance : No significant abnormality

Refer to standard electrical characteristics list

Terminal Strength

Solderability

Rated Current

Temperature Rise Test

Solder Heat Resistance

Impedance

DC Resistance

Electrical Characteristics Test

ITEM

10±0.5

seconds

cooling

Dip Time : 10±0.5sec.

Solder : Sn-Ag3.0-Cu0.5

Flux for lead free : rosin

Dip Time : 4±1sec.

Preheat : 150°C, 60sec.

Solder Temperature : 245±5°C

For Z Series :

Dipping

Preheating

Natural

4±1.0

seconds

cooling

60

seconds

60

seconds

HP4338B

HP4291A, HP4287A+16092A

1. Applied the allowed DC current.

Solder Temperature : 260±5°C

Solder : Sn-Ag3.0-Cu0.5

Preheat : 150°C, 60sec.

Flux for lead free : rosin

2. Temperature measured by digital surface thermometer.

Natural

Preheating Dipping

PERFORMANCE

TEST CONDITION