M95320WDW6TP datasheet(44/46 Pages) STMICROELECTRONICS

44 / 46 page

Revision history

M95320, M95640, M95320-x, M95640-x

44/46

07-Jul-2006

Document converted to new ST template.

Packages are ECOPACK® compliant. PDIP package removed.

SO8N package specifications updated (see Table 22 and Figure 18).

M95640-S and M95320-S part numbers removed (DC and AC parameters

updated accordingly).

How to identify previous, current and new products by the Process

identification letter Table removed.

Figure 4: SPI modes supported updated and Note 2 added. First three

paragraphs of Section 4: Operating features replaced by Section 4.1:

Supply voltage (VCC).

TA added to Table 7: Absolute maximum ratings. ICC and ICC1 updated in

Table 13, Table 13, Table 14 and Table 16. VOL and VOH updated in

Table 14. ICC updated in Table 15. Data in Table 16 is no longer

preliminary.

tCH updated in Table 18. Table 21: AC characteristics (M95640-R) added.

Timing line of tSHQZ modified in Figure 17: Serial output timing.

Process letter added to Table 25: Ordering information scheme, Note 2

removed. Note 2 removed from Figure 2.

09-Oct-2007

JEDEC standard revision updated to D in Note 1 below Table 7: Absolute

maximum ratings.

Note 2 removed below Figure 3 and explanatory paragraph added.

Section 4.1: Supply voltage (VCC) updated. Table 6: Address range bits

corrected.

Products operating at VCC = 4.5 V to 5.5 V are no longer available in the

device grade 6 TA temperature range.

ICC and ICC1 parameters modified in Table 14: DC characteristics

(M95320-W and M95640-W, device grade 6).

Maximum frequency for M95640-W and M95320-W upgraded from 5 MHz

to 10 MHz in the device grade 6 TA temperature range (Table 18: AC

characteristics (M95320-W and M95640-W, device grade 6) modified

accordingly).

Table 27: Available M95640x products (package, voltage range,

temperature grade): /PB process letter added, /P process letter removed.

Blank option removed below Plating technology in Table 25: Ordering

information scheme.

Table 26 and Table 27 added. Small text changes.

Table 24: UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead,

package mechanical data updated.

Package mechanical inch values calculated from mm and rounded to 4

decimal digits in Section 10: Package mechanical data.

17-Dec-2007

Section 2.7: VSS ground added.

Device behavior when VCC passes over the POR threshold updated (see

Section 4.1.2: Device reset and Section 4.1.4: Power-down).

VIL and VIH modified in Table 16: DC characteristics (M95320-R and

M95640-R).

tW, write time, modified in Table 20: AC characteristics (M95320-R) and

Table 21: AC characteristics (M95640-R). Small text changes.

Table 28.

Document revision history (continued)

Date

Revision

Changes

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