SN74LVC07AIPWREP datasheet(2/12 Pages) TI

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Absolute Maximum Ratings

(1)

Recommended Operating Conditions

(1)

SN74LVC07A-EP

SCAS738D – DECEMBER 2003 – REVISED JUNE 2008 .................................................................................................................................................. www.ti.com

LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6.5

Input voltage range(2)

–0.5

6.5

Output voltage range

–0.5

6.5

IIK

Input clamp current

VI < 0

–50

IOK

Output clamp current

VO < 0

–50

Continuous output current

±50

Continuous current through each VCC or GND

±100

Package thermal impedance(3)

113

°C/W

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

MIN

MAX

UNIT

VCC

Supply voltage

1.65

5.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

VCC =2.7 V to 3.6 V

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

VCC = 2.7 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

Input voltage

5.5

Output voltage

5.5

VCC = 1.65 V

VCC = 2.3 V

IOL

Low-level output current

VCC = 2.7 V

VCC = 3 V

VCC = 4.5 V

SN74LVC07AIPWREP

–40

Operating free-air temperature

°C

SN74LVC07AMPWREP

–55

125

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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