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STR911FAM47 Datasheet(PDF) 98 Page - STMicroelectronics

Part # STR911FAM47
Description  ARM966E-S??16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA
PDF  101 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STR911FAM47 Datasheet(HTML) 98 Page - STMicroelectronics

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Package mechanical data
STR91xFAx3x, STR91xFAx4x
98/101
9.2
Thermal characteristics
The average chip-junction temperature, TJ must never exceed 125° C.
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
–TA is the Ambient Temperature in °C,
Θ
JA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
–PD is the sum of PINT and PI/O (PD = PINT + PI/O),
–PINT is the product of IDD and VDD, expressed in Watts. This is the Chip
Internal Power.
PI/O represents the Power Dissipation on Input and Output Pins;
Most of the time for the applications PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories. The worst case PINT of the STR91xFA is 500mW (IDD x VDD, or 250mA x
2.0V).
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C) (2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2(3)
where:
K is a constant for the particular part, which may be determined from
equation (3) by measuring PD (at equilibrium) for a known TA. Using this
value of K, the values of PD and TJ may be obtained by solving
equations (1) and (2) iteratively for any value of TA.
Table 50.
Thermal characteristics
Symbol
Parameter
Value
Unit
Θ
JA
Thermal Resistance Junction-Ambient
LQFP 80 - 12 x 12 mm / 0.5 mm pitch
41.5
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LQFP128 - 14 x 14 mm / 0.4 mm pitch
38
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
36.5
°C/W



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