B32656S7684564 datasheet(57/66 Pages) EPCOS

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57 12/21

Please read Cautions and warnings and

Important notes at the end of this document.

Metallized polypropylene film capacitors (MKP)

B32656S, B32658S

Snubber (wound)

1.3

General notes on soldering

Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-

gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit

can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical

characteristics. For short exposures (as in practical soldering processes) the heat load (and thus

the possible effects on a capacitor) will also depend on other factors like:

Pre-heating temperature and time

Forced cooling immediately after soldering

Terminal characteristics:

diameter, length, thermal resistance, special configurations (e.g. crimping)

Height of capacitor above solder bath

Shadowing by neighboring components

Additional heating due to heat dissipation by neighboring components

Use of solder-resist coatings

Immersion depth

2.0 +0/–0.5 mm from capacitor body or seating plane

Shield

Heat-absorbing board, (1.5

±0.5) mm thick, between

capacitor body and liquid solder

Evaluation criteria:

Visual inspection

ΔC/C0

tan

No visible damage

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

As specified in sectional specification

B32656S7684564 Datasheet(PDF) 57 Page - EPCOS