REV.

B

CMP401/CMP402

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the CMP401/CMP402 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Total Analog Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 16 V

Digital Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Analog Positive Supply—Digital Positive Supply . . . . –200 mV

Input Voltage

2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±7 V

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .

±9 V

Output Short-Circuit Duration to GND . . . . . . . . . Indefinite

Storage Temperature Range

S, RU Package . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C

Operating Temperature Range

CMP401G, CMP402G . . . . . . . . . . . . . . –40

°C to +125°C

Junction Temperature Range

S, RU Package . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300

°C

JA

3

JC

Units

113

37

°C/W

Package Type

16-Lead

SOIC (S)

16-Lead TSSOP (RU)

180

37

°C/W

NOTES

1Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.

2The analog input voltage is equal to

±7 V or the analog supply voltage, whichever

is less.

3

JA is specified for the worst-case conditions, i.e.,

JA is specified for device soldered

in circuit board for SOIC and TSSOP packages.

PIN CONFIGURATIONS

16-Lead Narrow-

SOIC

(

S-Suffix)

14

13

12

11

16

15

10

9

8

1

2

3

4

7

6

5

OUT B

OUT A

V+ DIG

V+ ANA

–IN A

+IN A

–IN B

+IN B

V– ANA

DIG GND

OUT D

OUT C

–IN C

+IN D

–IN D

+IN C

TOP VIEW

(Not to Scale)

CMP401/

402

16-Lead

TSSOP

(RU-Suffix)

OUT B

OUT A

V+ DIG

V+ ANA

–IN A

+IN A

–IN B

+IN B

V– ANA

DIG GND

OUT D

OUT C

–IN C

+IN D

–IN D

+IN C

116

8

9

TOP VIEW

(Not to Scale)

CMP401/

402

+IN

–IN

V+ ANA

V– ANA

V+ DIG

OUT

DIG GND

Figure 1. Simplified Schematic

Revision History

Location

Page

Data Sheet changed from REV. 0 to REV. A.

Changed SO-16 to 16-Lead SOIC . . . . . . . . . . . . .Throughout

Edits to GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . .1

Moved Outline Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Edits to ABSOLUTLE MAXIMUM RATINGS. . . . . . . . . .4

Edits to PACKAGE TYPE. . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . 4

Deleted DICE CHARACTERISTICS . . . . . . . . . . . . . . . . . 4

Edits to CMP401/CMP402 PIN CONFIRGURATIONS. . 4

Data Sheet changed from REV.

A to REV. B.

Updated Outline Dimensions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Changes to Ordering Guide . . . . . . . . . .. . . . . . . . . . . . . . . . 8

Moved Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Location

Page