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AS1110

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VDD to GND

0

7

V

Input Voltage

-0.4

VDD

+0.4

V

Output Voltage

-0.4

15

V

GND Pin Current

2000

mA

24-pin SSOP package

2800

mA

28-pin QFN (5x5mm) package

Thermal Resistance

ΘJA

88

ºC/W

on PCB, 24-pin SSOP package

23

ºC/W

on PCB, 28-pin QFN (5x5mm) package

Ambient Temperature

-40

+85

ºC

Storage Temperature

-55

150

ºC

Humidity

5

86

%

Non-condensing

Electrostatic Discharge

Digital Outputs

2

kV

Norm: MIL 833 E method 3015

All Other Pins

2

Latch-Up Immunity

-100 -

(INOM x 0.5)

+100 +

INOM

mA

EIA/JESD78

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020D

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Moisture Sensitivity

Level

SOIC

3

Represents a maximum floor life of 168h

QFN

1

Represents an infinite floor lifetime