Data Sheet

HUSB238

©2023 Hynetek Semiconductor Co., Ltd. All rights reserved.

Page 7 of 17

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN, GATE

−0.3V to +30V

CC1, CC2

−0.3V to +25V

D+, D−

−0.3V to +12V

VSET, ISET, SDA, SCL

−0.3V to +6V

Operating Temperature Range (Junction)

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Electrostatic Discharge (ESD)

Human Body Mode (HBM)

±6000V

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product.

This is a stress rating only; functional operation of the product at these or any other conditions above those indicated

in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close

attention to PCB thermal design is required.

θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

DFN-10L

75

54

°C/W

ESD CAUTION

Electrostatic Discharge Sensitive Device.

Charged devices and circuit boards can discharge without detection. Although this product features patented

or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of functionality.