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AM261...ZEJ Datasheet(PDF) 101 Page - Texas Instruments

Part # AM261...ZEJ
Description  AM261x Sitara™ Microcontrollers
PDF  218 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

AM261...ZEJ Datasheet(HTML) 101 Page - Texas Instruments

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6.10.4 ZNC Package Thermal Characteristics
It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.
PARAMETER
DESCRIPTION
℃/W(1) (2)
AIR FLOW (m/s)
(3)
RΘJC
Junction-to-case
8.3
N/A
RΘJB
Junction-to-board
5.8
N/A
RΘJA
Junction-to-free air
21.9
0
RΘJA
Junction-to-moving air
15.5
1
14.3
2
13.5
3
ΨJT
Junction-to-package top
0.15
0
0.44
1
0.58
2
0.69
3
ΨJB
Junction-to-board
5.8
0
5.4
1
5.4
2
5.3
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
℃/W = degrees Celsius per watt
(3)
m/s = meters per second
www.ti.com
AM2612, AM2611, AM2611-Q1, AM2612-Q1
SPRSPA7C – SEPTEMBER 2024 – REVISED JULY 2025
Copyright © 2025 Texas Instruments Incorporated
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101
Product Folder Links: AM2612 AM2611 AM2611-Q1 AM2612-Q1



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