Symbol

Parameter

Value

Unit

Ambient Operating Temperature

0 to 70

°C

–40 to 85

°C

(2)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

–0.3 to 7

V

Supply Voltage

–0.3 to 7

V

Output Current

20

mA

Power Dissipation

1

W

Notes: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may

affect reliability.

2. Soldering temperature not to exceed 260

°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).

CAUTION: Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-up mode.

CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Mode

E1

E2

G

W

DQ0-DQ7

Power

Deselect

4.75V to 5.5V

or

4.5V to 5.5V

X

X

X

High Z

Standby

Deselect

X

X

X

High Z

Standby

Write

Active

Read

Active

Read

High Z

Active

Deselect

(2)

X

X

X

X

High Z

CMOS Standby

Deselect

X

X

X

X

High Z

Battery Back-up Mode

2. See Table 7 for details.

A1

A0

DQ0

A7

A4

A3

A2

A6

A5

E2

A10

A8

A9

DQ7

W

A11

G

E1

DQ5

DQ1

DQ2

DQ3

VSS

DQ4

DQ6

A12

FT

VCC

AI01375B

M48T58

M48T58Y

8

1

2

3

4

5

6

7

9

10

11

12

13

14

16

15

28

27

26

25

24

23

22

21

20

19

18

17

Figure 2A. DIP Pin Connections

AI01376B

8

2

3

4

5

6

7

9

10

11

12

13

14

22

21

20

19

18

17

16

15

28

27

26

25

24

23

1

A1

A0

DQ0

A7

A4

A3

A2

A6

A5

E2

A10

A8

A9

DQ7

W

A11

G

E1

DQ5

DQ1

DQ2

DQ3

VSS

DQ4

DQ6

A12

FT

VCC

M48T58Y

Figure 2B. SOIC Pin Connections

2/17

M48T58, M48T58Y