WINCS02 datasheet(17/73 Pages) MICROCHIP

17 / 73 page

WINCS02IC and WINCS02 Family

Device Overview

Data Sheet

DS70005577B - 17

• Exposed GND pads on the bottom of the WINCS02 Module must be soldered to the host board

(see the Example of Host Board on Top Layer figure in the WINCS02 Module Routing Guidelines from

Related Links).

• A PCB cutout or a copper keepout is required under the RF test point (see WINCS02 Module

Packaging Information from Related Links).

• Copper keepout areas are required on the top layer under voltage test points (see WINCS02

Module Packaging Information from Related Links).

• Alternatively, the entire region, except the exposed ground paddle, can be solder-masked.

The following figure illustrates the examples of WINCS02 Module placement on a host board with a

ground plane. Refer to the following figure for placement-specific guidance.

Figure 2-9. Module Placement Guidelines

5.3 mm

15.73 mm

Host PCB Ground Plane

No Copper Region

Edge of Host PCB Ground Plane

Module PCB Edge

31.75 mm (keepout clearance region)

for all metallic and plastic structures

around the antenna. Refer to antenna-

specific details of the respective antenna.

The following figure illustrates the examples of the WINCS02 Module placement on a host board

with a ground plane. Refer to Figure 2-9 for placement-specific guidance.

WINCS02 Datasheet(PDF) 17 Page - Microchip Technology