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TLV6001, TLV6002, TLV6004

SBOS779D – JUNE 2016 – REVISED MAY 2017

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Product Folder Links: TLV6001 TLV6002 TLV6004

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: TLV6001

THERMAL METRIC(1)

TLV6001

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

228.5

281.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.1

91.6

°C/W

RθJB

Junction-to-board thermal resistance

54.6

59.6

°C/W

ψJT

Junction-to-top characterization parameter

7.7

1.5

°C/W

ψJB

Junction-to-board characterization parameter

53.8

58.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: TLV6002

THERMAL METRIC(1)

TLV6002

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

138.4

191.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89.5

61.9

°C/W

RθJB

Junction-to-board thermal resistance

78.6

111.9

°C/W

ψJT

Junction-to-top characterization parameter

29.9

5.1

°C/W

ψJB

Junction-to-board characterization parameter

78.1

110.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: TLV6004

THERMAL METRIC(1)

TLV6004

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

121.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

49.4

°C/W

RθJB

Junction-to-board thermal resistance

62.8

°C/W

ψJT

Junction-to-top characterization parameter

5.9

°C/W

ψJB

Junction-to-board characterization parameter

62.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W