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TLV6001UIDBVT Datasheet(PDF) 20 Page - Texas Instruments |
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TLV6001UIDBVT Datasheet(HTML) 20 Page - Texas Instruments |
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20 / 45 page ![]() + VIN VOUT RG RF ±IN +IN V± VS+ GND VS± GND VOUT VIN Run the input traces as far away from the supply lines as possible. Use a low-ESR, ceramic bypass capacitor. RF RG Place components close to the device and to each other to reduce parasitic errors. Use a low-ESR, ceramic bypass capacitor. OUT V+ Copyright © 2016, Texas Instruments Incorporated 20 TLV6001, TLV6002, TLV6004 SBOS779D – JUNE 2016 – REVISED MAY 2017 www.ti.com Product Folder Links: TLV6001 TLV6002 TLV6004 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good printed circuit board (PCB) layout practices, including: • Noise may propagate into analog circuitry through the power pins of the circuit and the operational amplifier. Use bypass capacitors to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications. • Separate grounding for analog and digital portions of the circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are typically devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Take care to physically separate digital and analog grounds, paying attention to the flow of the ground current. For more detailed information, refer to Circuit Board Layout Techniques (SLOA089). • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If the traces cannot be kept separate, crossing the sensitive trace perpendicularly is much better than crossing in parallel with the noisy trace. • Place the external components as close to the device as possible. Keep RF and RG close to the inverting input in order to minimize parasitic capacitance, as shown in Figure 25. • Keep the length of input traces as short as possible. Remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring may significantly reduce leakage currents from nearby traces that are at different potentials. 11.2 Layout Example Figure 25. Operational Amplifier Board Layout for Noninverting Configuration Figure 26. Schematic Representation of Figure 25 |
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