Characteristics

STPS745

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DocID3516 Rev 8

0

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0

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25

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SCu(cm²)

D²PAK

Figure 7: Junction capacitance versus reverse

voltage applied (typical values)

Figure 8: Forward voltage drop versus forward

current (maximum values)

Figure 9: Thermal resistance junction to ambient versus copper surface under tab (epoxy

printed board FR4, eCu: 35 µm)

1

2

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1000

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OS C

RMS

j