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LP8733 Datasheet(PDF) 84 Page - Texas Instruments |
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LP8733 Datasheet(HTML) 84 Page - Texas Instruments |
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84 / 86 page  www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 28X (0.25) 28X (0.75) ( 0.2) TYP VIA (R0.05) TYP (1.45) (4.65) (4.65) (0.5) TYP ( 3.4) (1.45) VQFN - 1 mm max height RHD0028W PLASTIC QUAD FLATPACK - NO LEAD 4222120/B 02/2018 SYMM 1 7 8 14 15 21 22 28 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL EDGE SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL |
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