2007-10-08

8

LS Q971, LO Q971, LY Q971, LG Q971

Empfohlenes Lötpaddesign

8) Seite 13

IR Reflow Löten

Recommended Solder Pad

8) page 13

IR Reflow Soldering

Empfohlenes Lötpaddesign verwendbar für CHIPLED und Chipled - Bauform 0603

IR Reflow Löten

8) 9) Seite 13

Recommended Solder Pad useable for CHIPLED and Chipled - Package 0603

IR Reflow Soldering

8) 9) page 13

0.8 (0.031)

0.7 (0.028)

OHAPY606

0.8 (0.031)

OHPY0203

2.25 (0.089)

0.65 (0.026)

0.3 (0.012)

0.5 (0.020)