PACKAGE OPTION ADDENDUM

www.ti.com

23-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

LM239AMDREP

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AME

LM239AMDREP.A

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AME

LM239AMPWREP

Active

Production

TSSOP (PW) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AE

LM239AMPWREP.A

Active

Production

TSSOP (PW) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AE

LM239AQDREP

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

LM239AEP

LM239AQDREP.A

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AEP

V62/03672-01XE

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

LM239AEP

V62/03672-02XE

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AME

V62/03672-02YE

Active

Production

TSSOP (PW) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

LM239AE

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two

combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and

makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative

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