SRP5030HMCT Series – Shielded Power Inductors

L vs. I Charts (continued)

10.00

8.00

6.00

4.00

2.00

0

12.00

9.60

7.20

4.80

2.40

0

0

2.0

4.0

6.0

8.0

10.0

DC Current (A)

0

1.8

3.6

5.4

7.2

9.0

DC Current (A)

100

80

60

40

20

0

100

80

60

40

20

0

SRP5030HMCT-6R8M

20.00

16.00

12.00

8.00

4.00

0

0

1.1

2.2

3.3

4.4

5.5

DC Current (A)

100

80

60

40

20

0

SRP5030HMCT-150M

30.00

24.00

18.00

12.00

6.00

0

0

1.0

2.0

5.0

3.0

4.0

DC Current (A)

100

80

60

40

20

0

SRP5030HMCT-220M

SRP5030HMCT-8R2M

15.00

12.00

9.00

6.00

3.00

0

0

1.8

3.6

5.4

7.2

9.0

DC Current (A)

100

80

60

40

20

0

SRP5030HMCT-100M

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Soldering Profile

Tp

Tsmax

25

Time 25 °C to Peak

Time

TL

Tc -5 °C

tp

tL

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

PREHEAT AREA

Tsmin

ts

REFLOW TIMES: 3 TIMES MAX.

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min� (Tsmin)

- Temperature Max� (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max�

Liquidous temperature (TL)

Time (tL) maintained above TL

217 °C

60-150 seconds

Peak package body temperature (Tp)

250 °C

Time (tp) at Tc - 5 °C

(Tp should be equal to or less than Tc)

< 30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max�

Time 25 °C to Peak Temperature

8 minutes max�