Data Sheet

RH5596S-CSH

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 9 of 12

Table 4.

Parameter1

Rating

Supply Voltage (VCC)

3.8 V

Input Signal Power (RFIN), Average

15 dBm

Input Signal Power (RFIN), Peak2

20 dBm

DC Voltage at RFIN

–0.3 V to +1 V

DC Voltage at FLTR

–0.3 V to +0.4 V

DC Voltage at EN

–0.3 V to +3.8 V

TJMAX

150°C

Operating Temperature Range

–40°C to 125°C

Storage Temperature Range

–65°C to 150°C

1 The voltage on all pins must not exceed 3.8 V, VCC + 0.3 V, or be less than

–0.3 V, otherwise damage to the ESD diodes may occur.

2 Not production tested. Guaranteed by design and correlation to production

tested parameters.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to the printed circuit board

(PCB) design and operating environment. Careful attention to the

PCB thermal design is required.

θJC is the junction-to-case thermal resistance.

Table 5. Thermal Resistance

Package Option

θJC

Unit

05-08-1957

25

°C/W

OUTGAS TESTING

The criteria used for the acceptance and rejection of materials must

be determined by the user and based upon specific component and

system requirements. Historically, a total mass loss (TML) of 1.00%

and collected volatile condensable material (CVCM) of 0.10% have

been used as screening levels for rejection of spacecraft materials.

Table 6. Outgas Testing

Specification (Tested per ASTM E595-15)

Value

Unit

Total Mass Lost

0.06

%

Collected Volatile Condensable Material

0.01

%

Table 6. Outgas Testing (Continued)

Specification (Tested per ASTM E595-15)

Value

Unit

Water Vapor Recovered

0.02

%

RADIATION FEATURES

Table 7. Radiation Features

Specifications

Value

Unit

Maximum Total Dose Available (Dose Rate = 50

rad(Si)/s to 300 rad(Si)/s)1

100

krad(Si)

No Single Event Latch-Up (SEL) Occurs at Effective

Linear Energy Transfer (LET)2

≤80

MeV-

cm2/mg

1 Guaranteed by device and process characterization. Contact Analog Devices,

Inc., for data available up to 100 krads.

2 Limits are characterized at initial qualification and after any design or process

changes that may affect the SEL characteristics but are not production lot test-

ed, unless specified by the customer through the purchase order or contract.

For more information on single event effect (SEE) test results, contact Analog

Devices for further data beyond published report on the Analog Devices

website.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in and ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Rating for the RH5596S-CSH

Table 8. RH5596S-CSH, 8-Lead Plastic LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

3500

2

CDM

2000

C3

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.