ADA4511-2ARMZ-R7 datasheet(6/28 Pages) AD

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Data Sheet

ADA4511-2

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 6 of 28

Table 2. Absolute Maximum Ratings

Parameter

Rating

VSY ((V+) − (V−))

−0.3 V to +45 V

Input VCM

(+IN A, −IN A, +IN B, −IN B) − (V−)

−0.3 V to +45 V

(+IN A, −IN A, +IN B, −IN B) − (V+)

+0.3 V to −45 V

Differential Input Voltage

(+IN A) − (−IN A), (+IN B) − (−IN B)

±45 V

Input Current

±10 mA

Output Short-Circuit Duration1

Continuous

Temperature Range

Storage

−65°C to +150°C

Operating

−40°C to +125°C

150°C

Lead (soldering, 10 seconds)

300°C

260°C

1 A heatsink may be required to keep the TJ below the absolute maximum rating

when the output is shorted indefinitely.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC is the junction-to-case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

R-8

108.5

34.12

°C/W

RM-8

141.24

51.87

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001-2017.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002-2018.

ESD Ratings for ADA4511-2

Table 4. ADA4511-2, 8-Lead SOIC_N, 8-Lead MSOP

ESD Model

Withstand Threshold (V)

Class

HBM

±1000

FICDM

±400

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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