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ADIN1300CCPZ-R7 Datasheet(PDF) 13 Page - Analog Devices

Part # ADIN1300CCPZ-R7
Description  Robust, Industrial, Low Latency and Low Power 10 Mbps, 100 Mbps, and 1 Gbps Ethernet PHY
PDF  96 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADIN1300CCPZ-R7 Datasheet(HTML) 13 Page - Analog Devices

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Data Sheet
ADIN1300
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. B | 13 of 96
TA = 25°C, unless otherwise noted.
Table 11.
Parameter
Rating
VDDIO to GND
−0.3 V to +3.63 V
DVDD_0P9 to GND
−0.3 V to +1.1 V
AVDD_3P3 to GND
−0.3 V to +3.63 V
MAC Interface to GND
−0.3 V to VDDIO + 0.3 V
LINK_ST, GP_CLK
−0.3 V to VDDIO + 0.3 V
MDIO, MDC, INT_N to GND
−0.3 V to +3.63 V
MDI_x_x to GND
−0.3 V to AVDD_3P3 +
0.3 V
LED_0, RESET_N, XTAL_I/CLK_IN/REF_CLK,
XTAL_O, CLK25_REF
−0.3 V to AVDD_3P3 +
0.3 V
Operating Temperature Range (TA)
Industrial
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature (TJ Maximum)
125°C
Power Dissipation
(TJ maximum − TA)/θJA
Lead Temperature
JEDEC industry-standard
Soldering
J-STD-020
Electrostatic Discharge (ESD)
Human Body Model (HBM)
MDI_x_x Pins
4 kV
All Other Pins
2 kV
Machine Model (MM)
200 V
Field Induced Charged Device Model (FICDM)
1.25 kV
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to PCB
thermal design is required.
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 12. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-40-26
451
251
°C/W
302
°C/W
1 Based on simulated data using a JEDEC 2s2p thermal test board with a 3 × 3
array of thermal vias in a JEDEC natural convection environment. See JEDEC
specification JESD-51 for details.
2 Test Condition 1: thermal impedance measured on Analog Devices, Inc.,
hardware, 2S2P with 4 × 4 via array.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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