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MPX2202DP Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MPX2202DP Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 10 page ![]() MPX2202 Sensors Freescale Semiconductor 5 Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202/MPXV2202G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Lead Frame Wire Bond Differential/gauge Die Silicone Gel Die Coat Differential/Gauge Element P2 DIE Bond Epoxy Case Stainless Steel Metal Cover P1 Silicone Gel Die Coat Absolute Die P1 Metal Cover Epoxy Case Absolute Element P2 Lead Frame Wire Bond Die Bond Stainless Steel Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number Case Type Pressure (P1) Side Identifier MPX2202A/D 344 Stainless Steel Cap MPX2202DP 344C Side with Part Marking MPX2202AP/GP 344B Side with Port Attached MPX2202ASX 344F Side with Port Attached MPXV2202GP 1369 Side with Port Attached MPXV2202DP 1351 Side with Part Marking |
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