Technical Data

Data Sheet N0204, Rev. B

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MMBZ5221B-MMBZ5259B

MMBZ5221B-MMBZ5259B ZENER DIODES

Parameter

Symbol

Value

Units

Power Dissipation (Note 1)

PD

410

mW

Forward Voltage

@ IF = 10mA

VF

1.0

V

Typical Thermal resistance junction to Ambient Air (Note 1)

RθJA

357

°C/W

Operating Junction and Storage

Temperature Range

TJ,TSTG

-55 to 150

°C

Notes: 1. Valid provided that device terminals are kept at ambient temperature.

2. Tested with pulses, Tp≤1.0ms.

Features

Schematic & Pin Configuration

Mechanical Characteristics

Maximum Ratings@TA=25°C unless otherwise specified



Planar Die Construction



410mW Power Dissipation



General Purpose, Medium Current



Ideally Suited for Automated Assembly Processes



This is a Pb − Free Device



All SMC parts are traceable to the wafer lot



Additional testing can be offered upon request

SOT-23



Case: SOT-23, Molded Plastic



Terminals: Plated leads Solderable per MIL-STD-750,

Method 2026



Mounting Position: Any



Weight: 0.008g