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PBYR2100CT Datasheet(PDF) 3 Page - NXP Semiconductors |
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PBYR2100CT Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 May 25 3 Philips Semiconductors Product specification Schottky barrier double diode PBYR2100CT LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. Refer to SOT223 standard mounting conditions. 2. For Schottky barrier diodes thermal run-away has to be considered, as in some applications, the reverse power losses PR are a significant part of the total power losses. Nomograms for determination of the reverse power losses PR and IF(AV) rating will be available on request. ELECTRICAL CHARACTERISTICS Tamb =25 °C unless otherwise specified. Note 1. Pulse test: tp = 300 µs; δ = 0.02. THERMAL CHARACTERISTICS Note 1. Refer to SOT223 standard mounting conditions. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode VR continuous reverse voltage − 100 V VRRM repetitive peak reverse voltage − 100 V VRWM crest working reverse voltage − 100 V IF(AV) average forward current Tamb =85 °C; see Fig.2; Rth j-a = 70 K/W; note 1; VR(equiv) = 0.2 V; note 2 − 1A IFSM non-repetitive peak forward current t = 8.3 ms half sine wave; JEDEC method − 10 A IRSM non-repetitive peak reverse current tp = 100 µs − 0.5 A Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C Tamb operating ambient temperature − 85 °C SYMBOL PARAMETER CONDITIONS MAX. UNIT Per diode VF forward voltage IF = 1 A; note 1; see Fig.3 790 mV IF = 1 A; Tj = 100 °C; note 1; see Fig.3 690 mV IR reverse current VR =VRRMmax; note 1; see Fig.4 0.5 mA VR =VRRMmax; Tj = 100 °C; note 1; see Fig.4 5 mA Cd diode capacitance VR = 4 V; f = 1 MHz; see Fig.5 100 pF SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 70 K/W |
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