CS51411, CS51412, CS51413, CS51414

http://onsemi.com

20

PACKAGE DIMENSIONS

DFN18

CASE 505−01

ISSUE C

C

0.15

E2

D2

L

b

18X

A

D

NOTES:

1. DIMENSIONS AND TOLERANCING PER

ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E

C

e

A

B

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

6.00 BSC

D2

3.98

4.28

E

5.00 BSC

E2

2.98

3.28

e

0.50 BSC

K

0.20

−−−

L

0.45

0.65

C

0.15

PIN 1 LOCATION

A1

(A3)

SEATING

PLANE

C

0.08

C

0.10

18X

K

18X

A

0.10

B

C

19

10

18

2X

2X

18X

SIDE VIEW

TOP VIEW

BOTTOM VIEW

5.30

18X

3.24

0.75

18X

0.30

4.19

PITCH

DIMENSIONS: MILLIMETERS

0.30

1

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

PACKAGE THERMAL DATA

Parameter

DFN18

Unit

Typical

35

°C/W

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