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SN74CBT16811CDL Datasheet(PDF) 2 Page - Texas Instruments

Part # SN74CBT16811CDL
Description  24-BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS 5-V BUS SWITCH WITH-2-V UNDERSHOOT PROTECTION
PDF  11 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74CBT16811CDL Datasheet(HTML) 2 Page - Texas Instruments

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SN74CBT16811C
24BIT FET BUS SWITCH WITH PRECHARGED OUTPUTS
5V BUS SWITCH WITH 2V UNDERSHOOT PROTECTION
SCDS118C − JANUARY 2003 − REVISED OCTOBER 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description/ordering information (continued)
The SN74CBT16811C is organized as two 12-bit bus switches with separate output-enable (1OE, 2OE) inputs.
It can be used as two 12-bit bus switches or as one 24-bit bus switch. When OE is low, the associated 12-bit
bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When
OE is high, the associated 12-bit bus switch is OFF, and a high-impedance state exists between the A and B
ports. The B port is precharged to BIASV through the equivalent of a 10-k
Ω resistor when OE is high, or if the
device is powered down (VCC = 0 V).
During insertion (or removal) of a card into (or from) an active bus, the card’s output voltage may be close to
GND. When the connector pins make contact, the card’s parasitic capacitance tries to force the bus signal to
GND, creating a possible glitch on the active bus. This glitching effect can be reduced by using a bus switch
with precharged bias voltage (BIASV) of the bus switch equal to the input threshold voltage level of the receivers
on the active bus. This method will ensure that any glitch produced by insertion (or removal) of the card will not
cross the input threshold region of the receivers on the active bus, minimizing the effects of live-insertion noise.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SSOP − DL
Tube
SN74CBT16811CDL
CBT16811C
SSOP − DL
Tape and reel
SN74CBT16811CDLR
CBT16811C
−40
°C to 85°C
TSSOP − DGG
Tube
SN74CBT16811CDGG
CBT16811C
−40 C to 85 C
TSSOP − DGG
Tape and reel
SN74CBT16811CDGGR
CBT16811C
TVSOP − DGV
Tape and reel
SN74CBT16811CDGVR
CY811C
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each 12-bit bus switch)
INPUT
INPUT/OUTPUT
FUNCTION
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
B port = BIASV



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