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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard

C1070_C0G_HV_FT-CAP_SMD • 2/28/2023

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

P

0

T

F

W

Center Lines of Cavity

A

0

B

0

User Direction of Unreeling

Cover Tape

K

0

B

1 is for tape feeder reference only,

including draft concentric about B

0.

T

2

ØD

1

ØD

0

B

1

S

1

T

1

E

1

E

2

P

1

P

2

Embossment

For cavity size,

see Note 1 Table 4

(10 pitches cumulative

tolerance on tape ±0.2 mm)

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

D

0

D

1 Minimum

Note 1

E

1

P

0

P

2

R Reference

Note 2

S

1 Minimum

Note 3

T

Maximum

T

1

Maximum

8 mm

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.0

(0.039)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

1.5

(0.059)

30

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

B

1 Maximum

Note 4

E

2

Minimum

F

P

1

T

2

Maximum

W

Maximum

A

0,B0 & K0

8 mm

Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.5

(0.098)

8.3

(0.327)

Note 5

12 mm

Single (4 mm)

and double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm

Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05

(0.138 ±0.002)

12.0 ±0.10

(0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment

location and the hole location shall be applied independently of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6.)

3. If S

1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)

4. B

1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity defined by A

0, B0 and K0 shall surround the component with sufficient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been

removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape

(see Figure 4.)

(e) for KPS product, A

0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.